Detecting leaks in liquid-cooled information handling systems with moisture wicking material

ABSTRACT

An information handling system may include an information handling resource, a liquid cooling system for providing cooling of the information handling resource, and a leak detection system for detecting a leak of fluid from the liquid cooling system, the leak detection system comprising a leak detection circuit having at least one moisture-sensitive portion configured to detect the presence of moisture proximate to the leak detection circuit and circuitry configured to communicate one or more electrical signals indicative of the presence or absence of moisture proximate to the leak detection circuit and a moisture wicking material mechanically coupled to the leak detection circuit and configured to transport moisture within the moisture wicking material to the at least one moisture-sensitive portion of the leak detection circuit.

TECHNICAL FIELD

The present disclosure relates in general to information handlingsystems, and more particularly to leak detection in liquid-cooledinformation handling systems.

BACKGROUND

As the value and use of information continues to increase, individualsand businesses seek additional ways to process and store information.One option available to users is information handling systems. Aninformation handling system generally processes, compiles, stores,and/or communicates information or data for business, personal, or otherpurposes thereby allowing users to take advantage of the value of theinformation. Because technology and information handling needs andrequirements vary between different users or applications, informationhandling systems may also vary regarding what information is handled,how the information is handled, how much information is processed,stored, or communicated, and how quickly and efficiently the informationmay be processed, stored, or communicated. The variations in informationhandling systems allow for information handling systems to be general orconfigured for a specific user or specific use such as financialtransaction processing, airline reservations, enterprise data storage,or global communications. In addition, information handling systems mayinclude a variety of hardware and software components that may beconfigured to process, store, and communicate information and mayinclude one or more computer systems, data storage systems, andnetworking systems.

As processors, graphics cards, random access memory (RAM) and othercomponents in information handling systems have increased in clock speedand power consumption, the amount of heat produced by such components asa side-effect of normal operation has also increased. Often, thetemperatures of these components need to be kept within a reasonablerange to prevent overheating, instability, malfunction and damageleading to a shortened component lifespan. Accordingly, air movers(e.g., cooling fans and blowers) have often been used in informationhandling systems to cool information handling systems and theircomponents.

To control temperature of components of an information handling system,an air mover may direct air over one or more heatsinks thermally coupledto individual components. Traditional approaches to cooling componentsmay include a “passive” cooling system that serves to reject heat of acomponent to air driven by one or more system-level air movers (e.g.,fans) for cooling multiple components of an information handling systemin addition to the peripheral component. Another traditional approachmay include an “active” cooling system that uses liquid cooling, inwhich a heat-exchanging cold plate is thermally coupled to thecomponent, and a chilled fluid is passed through conduits internal tothe cold plate to remove heat from the component.

However, one disadvantage to using liquid cooling is that components ofthe liquid cooling system (e.g., fluid fittings, fluid joints, hoses orother fluidic conduits, pumps, cold plates, etc.) may develop leaks overtime due to vibration, thermal cycles, or aging. Liquid leaks within aninformation handling system may cause corrosion to components of theinformation handling system and/or damage to electrical or electroniccircuitry of the information handling system.

While solutions exist for leak detection, often such solutions areineffective. For example, one traditional solution is the use of a leakdetection cable, which may comprise a twisted pair cable having anelectrical impedance that changes in the presence of increased moistureon the leak detection cable. However, existing solutions have been shownto be insufficient due to their form factors and locations not allowingfor sensing of moisture in proximity to likely leak locations from aliquid cooling system.

SUMMARY

In accordance with the teachings of the present disclosure, thedisadvantages and problems associated with detecting leaks of fluid fromliquid cooling systems may be substantially reduced or eliminated.

In accordance with embodiments of the present disclosure, an informationhandling system may include an information handling resource, a liquidcooling system for providing cooling of the information handlingresource, and a leak detection system for detecting a leak of fluid fromthe liquid cooling system, the leak detection system comprising a leakdetection circuit having at least one moisture-sensitive portionconfigured to detect the presence of moisture proximate to the leakdetection circuit and circuitry configured to communicate one or moreelectrical signals indicative of the presence or absence of moistureproximate to the leak detection circuit and a moisture wicking materialmechanically coupled to the leak detection circuit and configured totransport moisture within the moisture wicking material to the at leastone moisture-sensitive portion of the leak detection circuit.

In accordance with these and other embodiments of the presentdisclosure, a leak detection system for detecting a leak of fluid mayinclude a leak detection circuit having at least one moisture-sensitiveportion configured to detect the presence of moisture proximate to theleak detection circuit and circuitry configured to communicate one ormore electrical signals indicative of the presence or absence ofmoisture proximate to the leak detection circuit and a moisture wickingmaterial mechanically coupled to the leak detection circuit andconfigured to transport moisture within the moisture wicking material tothe at least one moisture-sensitive portion of the leak detectioncircuit.

In accordance with these and other embodiments of the presentdisclosure, a method may include detecting the presence of moistureproximate to a moisture-sensitive portion of a leak detection circuit,communicating one or more electrical signals indicative of the presenceor absence of moisture proximate to the moisture-sensitive portion ofthe leak detection circuit, and transporting moisture within a moisturewicking material mechanically coupled to the leak detection circuit tothe moisture-sensitive portion of the leak detection circuit.

Technical advantages of the present disclosure may be readily apparentto one skilled in the art from the figures, description and claimsincluded herein. The objects and advantages of the embodiments will berealized and achieved at least by the elements, features, andcombinations particularly pointed out in the claims.

It is to be understood that both the foregoing general description andthe following detailed description are examples and explanatory and arenot restrictive of the claims set forth in this disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete understanding of the present embodiments and advantagesthereof may be acquired by referring to the following description takenin conjunction with the accompanying drawings, in which like referencenumbers indicate like features, and wherein:

FIG. 1 illustrates a block diagram of an example information handlingsystem, in accordance with embodiments of the present disclosure;

FIGS. 2A and 2B each illustrate isometric perspective views of aheat-rejecting media assembly including a leak detection systemmechanically coupled to heat-rejecting media, in accordance withembodiments of the present disclosure; and

FIG. 3 illustrates a cross-section elevation view of the heat-rejectingmedia assembly of FIGS. 2A and 2B, in accordance with embodiments of thepresent disclosure.

DETAILED DESCRIPTION

Preferred embodiments and their advantages are best understood byreference to FIGS. 1 through 3, wherein like numbers are used toindicate like and corresponding parts.

For the purposes of this disclosure, an information handling system mayinclude any instrumentality or aggregate of instrumentalities operableto compute, classify, process, transmit, receive, retrieve, originate,switch, store, display, manifest, detect, record, reproduce, handle, orutilize any form of information, intelligence, or data for business,scientific, control, entertainment, or other purposes. For example, aninformation handling system may be a personal computer, a PDA, aconsumer electronic device, a network storage device, or any othersuitable device and may vary in size, shape, performance, functionality,and price. The information handling system may include memory, one ormore processing resources such as a central processing unit (CPU) orhardware or software control logic. Additional components of theinformation handling system may include one or more storage devices, oneor more communications ports for communicating with external devices aswell as various input and output (I/O) devices, such as a keyboard, amouse, and a video display. The information handling system may alsoinclude one or more buses operable to transmit communication between thevarious hardware components.

For the purposes of this disclosure, computer-readable media may includeany instrumentality or aggregation of instrumentalities that may retaindata and/or instructions for a period of time. Computer-readable mediamay include, without limitation, storage media such as a direct accessstorage device (e.g., a hard disk drive or floppy disk), a sequentialaccess storage device (e.g., a tape disk drive), compact disk, CD-ROM,DVD, random access memory (RAM), read-only memory (ROM), electricallyerasable programmable read-only memory (EEPROM), and/or flash memory; aswell as communications media such as wires, optical fibers, microwaves,radio waves, and other electromagnetic and/or optical carriers; and/orany combination of the foregoing.

For the purposes of this disclosure, information handling resources maybroadly refer to any component system, device or apparatus of aninformation handling system, including without limitation processors,buses, memories, I/O devices and/or interfaces, storage resources,network interfaces, motherboards, integrated circuit packages;electro-mechanical devices (e.g., air movers), displays, and powersupplies.

FIG. 1 illustrates a block diagram of an example information handlingsystem 102, in accordance with embodiments of the present disclosure. Insome embodiments, information handling system 102 may comprise a serverchassis configured to house a plurality of servers or “blades.” In otherembodiments, information handling system 102 may comprise a personalcomputer (e.g., a desktop computer, laptop computer, mobile computer,and/or notebook computer). In yet other embodiments, informationhandling system 102 may comprise a storage enclosure configured to housea plurality of physical disk drives and/or other computer-readable mediafor storing data. As shown in FIG. 1, information handling system 102may include a chassis 100 housing a processor 103, a memory 104, atemperature sensor 106, a system air mover 108, a management controller112, a device 116, and a liquid cooling system 118 comprising a leakdetection system 138.

Processor 103 may comprise any system, device, or apparatus operable tointerpret and/or execute program instructions and/or process data, andmay include, without limitation a microprocessor, microcontroller,digital signal processor (DSP), application specific integrated circuit(ASIC), or any other digital or analog circuitry configured to interpretand/or execute program instructions and/or process data. In someembodiments, processor 103 may interpret and/or execute programinstructions and/or process data stored in memory 104 and/or anothercomponent of information handling system 102.

Memory 104 may be communicatively coupled to processor 103 and maycomprise any system, device, or apparatus operable to retain programinstructions or data for a period of time. Memory 104 may compriserandom access memory (RAM), electrically erasable programmable read-onlymemory (EEPROM), a PCMCIA card, flash memory, magnetic storage,opto-magnetic storage, or any suitable selection and/or array ofvolatile or non-volatile memory that retains data after power toinformation handling system 102 is turned off.

System air mover 108 may include any mechanical or electro-mechanicalsystem, apparatus, or device operable to move air and/or other gases inorder to cool information handling resources of information handlingsystem 102. In some embodiments, system air mover 108 may comprise a fan(e.g., a rotating arrangement of vanes or blades which act on the air).In other embodiments, system air mover 108 may comprise a blower (e.g.,a centrifugal fan that employs rotating impellers to accelerate airreceived at its intake and change the direction of the airflow). Inthese and other embodiments, rotating and other moving components ofsystem air mover 108 may be driven by a motor 110. The rotational speedof motor 110 may be controlled by an air mover control signalcommunicated from thermal control system 114 of management controller112. In operation, system air mover 108 may cool information handlingresources of information handling system 102 by drawing cool air into anenclosure housing the information handling resources from outside thechassis, expel warm air from inside the enclosure to the outside of suchenclosure, and/or move air across one or more heat sinks (not explicitlyshown) internal to the enclosure to cool one or more informationhandling resources.

Management controller 112 may comprise any system, device, or apparatusconfigured to facilitate management and/or control of informationhandling system 102 and/or one or more of its component informationhandling resources. Management controller 112 may be configured to issuecommands and/or other signals to manage and/or control informationhandling system 102 and/or its information handling resources.Management controller 112 may comprise a microprocessor,microcontroller, DSP, ASIC, field programmable gate array (“FPGA”),EEPROM, or any combination thereof. Management controller 112 also maybe configured to provide out-of-band management facilities formanagement of information handling system 102. Such management may bemade by management controller 112 even if information handling system102 is powered off or powered to a standby state. In certainembodiments, management controller 112 may include or may be an integralpart of a baseboard management controller (BMC), a remote accesscontroller (e.g., a Dell Remote Access Controller or Integrated DellRemote Access Controller), or an enclosure controller. In otherembodiments, management controller 112 may include or may be an integralpart of a chassis management controller (CMC).

As shown in FIG. 1, management controller 112 may include a thermalcontrol system 114. Thermal control system 114 may include any system,device, or apparatus configured to receive one or more signalsindicative of one or more temperatures within information handlingsystem 102 (e.g., one or more signals from one or more temperaturesensors 106), and based on such signals, calculate an air mover drivingsignal to maintain an appropriate level of cooling, increase cooling, ordecrease cooling, as appropriate, and communicate such air mover drivingsignal to system air mover 108. In these and other embodiments, thermalcontrol system 114 may be configured to receive information from otherinformation handling resources and calculate the air mover drivingsignal based on such received information in addition to temperatureinformation. For example, as described in greater detail below, thermalcontrol system 114 may receive configuration data from device 116 and/orother information handling resources of information handling system 102,which may include thermal requirement information of one or moreinformation handling resources. In addition to temperature informationcollected from sensors within information handling system 102, thermalcontrol system 114 may also calculate the air mover driving signal basedon such information received from information handling resources.

Temperature sensor 106 may be any system, device, or apparatus (e.g., athermometer, thermistor, etc.) configured to communicate a signal toprocessor 103 or another controller indicative of a temperature withininformation handling system 102. In many embodiments, informationhandling system 102 may comprise a plurality of temperature sensors 106,wherein each temperature sensor 106 detects a temperature of aparticular component and/or location within information handling system102.

Device 116 may comprise any component information handling system ofinformation handling system 102, including without limitationprocessors, buses, memories, I/O devices and/or interfaces, storageresources, network interfaces, motherboards, integrated circuitpackages; electro-mechanical devices, displays, and power supplies.

Oftentimes, an architecture of information handling system 102 may besuch that device 116 may be significantly downstream of system air mover108 that it may be significantly more effective for device 116 to becooled using liquid cooling system 118. Alternatively, device 116 maygenerate heat at a rate that air-based cooling is insufficient to cooldevice 116. As shown in FIG. 1, liquid cooling system 118 may include alocal thermal control system 124, heat-rejecting media 122, pump 134,radiator 136, valve 130, fluidic conduits 126, and a leak detectionsystem 138.

Local thermal control system 124 may be communicatively coupled totemperature sensor 106, and may include any system, device, or apparatus(e.g., a processor, controller, etc.) configured to control componentsof an liquid cooling system 118 for cooling a temperature of one or moreinformation handling resources of information handling system 102. Forexample, local thermal control system 124 may be configured to controlpump 134 and/or valve 130 based on thermal data sensed by temperaturesensor 106, so as to maintain a safe operating temperature for one ormore information handling resources. Accordingly, local thermal controlsystem 124 may include a pump control subsystem 127 for controllingoperation of pump 134 (e.g., a pressure applied to coolant fluid influidic conduits 126 for moving such fluid through fluidic conduits 126)and a valve load switch control subsystem 128 for controlling operationof valve 130 (e.g., opening or closing valve 130, controlling anaperture of valve 130, etc.).

Pump 134 may be fluidically coupled to one or more fluidic conduits 126and may comprise any mechanical or electro-mechanical system, apparatus,or device operable to produce a flow of fluid (e.g., fluid in one ormore conduits 126). For example, pump 134 may produce fluid flow byapplying a pressure to fluid in fluidic conduits 126. As describedabove, operation of pump 134 may be controlled by pump control subsystem127 which may control electro-mechanical components of pump 134 in orderto produce a desired rate of coolant flow.

Radiator 136 may include any device, system or apparatus configured totransfer thermal energy from one medium (e.g., fluid within a fluidicconduit 126) to another (e.g., air external to chassis 100) for thepurpose of cooling and heating. In some embodiments, radiator 136 mayinclude fluidic channels and/or conduits in at least a portion ofradiator 136. Such fluidic channels and/or conduits may be fluidicallycoupled to one or more of fluidic conduits 126 and pump 134.

Valve 130 may include any device, system or apparatus that regulates,directs, and/or controls the flow of a fluid (e.g., a coolant liquid influidic conduits 126) by opening, closing, or partially obstructing oneor more passageways. When valve 130 is open, coolant liquid may flow ina direction from higher pressure to lower pressure. As described above,the operation of valve 130 (e.g., opening and closing, size of anaperture of valve 130) may be controlled by valve load switch controlsubsystem 128.

In operation, pump 134 may induce a flow of liquid (e.g., water,ethylene glycol, propylene glycol, or other coolant) through variousfluidic conduits 126 of information handling system 102, valve 130and/or radiator 136. As fluid passes by heat-rejecting media 122 in afluidic conduit 126 proximate to device 116, heat may be transferredfrom device 116 to heat-rejecting media 122 and from heat-rejectingmedia 122 to the liquid coolant in fluidic conduit 126. As such heatedcoolant flows by radiator 136, heat from the coolant may be transferredfrom the coolant to air ambient to chassis 100, thus cooling the fluid.

Heat-rejecting media 122 may include any system, device, or apparatusconfigured to transfer heat from an information handling resource (e.g.,device 116, as shown in FIG. 1), thus reducing a temperature of theinformation handling resource. For example, heat-rejecting media 122 mayinclude a solid thermally coupled to the information handling resource(e.g., heatpipe, heat spreader, heatsink, finstack, etc.) such that heatgenerated by the information handling resource is transferred from theinformation handling resource.

Leak detection system 138 may be mechanically coupled to heat-rejectingmedia 122, as shown in greater detail below with respect to FIGS. 2A,2B, and 3. Further, leak detection system 138 may be communicativelycoupled to management controller 112 and may comprise any system,device, or apparatus configured to detect a presence of a leak of thecooling fluid of liquid cooling system 118, and generate one or moreelectrical signals indicative of whether such a leak is present. Asshown in FIG. 1, leak detection system 138 may include a leak detectioncircuit 142 and moisture wicking material 144.

Leak detection circuit 142 may comprise any system, device, or apparatusconfigured to detect the presence or absence of moisture proximate toleak detection circuit 142 and communicate one or more signals tomanagement controller 112 indicative of the presence or absence of aleak of cooling fluid from liquid cooling system 118. In someembodiments, leak detection circuit 142 may comprise a flexible printedcircuit board or a thin printed circuit board. Such printed circuitboard may include one or more exposed conductive traces 143, such thatleak detection circuit 142 may have an impedance (e.g., a resistiveimpedance, reactive impedance, or complex impedance) that may vary basedon whether moisture is present on exposed conductive traces 143. Forinstance, in some embodiments, exposed electrical traces 143 may have anelectrical resistance that decreases in the presence of increasedmoisture present on exposed conductive traces 143 and increases in thepresence of decreased moisture present on exposed electrical traces 143.In addition, leak detection circuit 142 may also include otherelectrical circuitry and/or logic that is capable of detecting suchchanges in electrical impedances and communicating one or more signalsto management controller 112 based on such detected changes, such one ormore signals indicative of the presence or absence of a leak of coolingfluid from liquid cooling system 118.

Moisture wicking material 144 may be formed over all or part of asurface of leak detection circuit 142, including any portion of leakdetection circuit 142 having exposed conductive traces 143. Moisturewicking material 144 may comprise felt, textile fiber, and/or any othersuitable material configured to transport at least a portion of liquidthat contacts moisture wicking material 144 from one portion of moisturewicking material 144 to another portion of moisture wicking material144, thus increasing the likelihood that liquid contacting moisturewicking material 144 is transported to portions of leak detectioncircuit 142 having exposed conductive traces 143 and will effect achange in impedance associated with exposed conductive traces 143. Insome embodiments, moisture wicking material 144 may include, or may betreated with, one or more substances in order to increase capillaryaction of moisture wicking material 144, enhance leak detection byincreasing magnitude of a change in electrical impedance associated withexposed traces of leak detection circuit 142, and/or change color whencoming into contact with liquid.

In addition to processor 103, memory 104, temperature sensor 106, airmover 108, management controller 112, device 116, liquid cooling system118, and leak detection system 138, information handling system 102 mayinclude one or more other information handling resources. In addition,for the sake of clarity and exposition of the present disclosure, FIG. 1depicts only one system air mover 108 and one device 116. In embodimentsof the present disclosure, information handling system 102 may includeany number of system air movers 108 and devices 116. Furthermore, forthe sake of clarity and exposition of the present disclosure, FIG. 1depicts device 116 including an liquid cooling system 118 for cooling ofdevice 116. However, in some embodiments, approaches similar oridentical to those used to cool device 116 as described herein may beemployed to provide cooling of processor 103, memory 104, managementcontroller 112, and/or any other information handling resource ofinformation handling system 102.

FIGS. 2A and 2B each illustrate isometric perspective views of aheat-rejecting media assembly 200 including a leak detection system 138mechanically coupled to heat-rejecting media 122, in accordance withembodiments of the present disclosure. FIG. 3 illustrates across-section elevation view of heat-rejecting media assembly 200 ofFIGS. 2A and 2B, in accordance with embodiments of the presentdisclosure.

As shown in FIGS. 2A, 2B, and 3, heat-rejecting media assembly 200 mayinclude heat-rejecting media comprising a cold plate base plate 202mechanically coupled to a load plate 204 via fasteners 208 (e.g., screwsand corresponding openings in cold plate base plate 202 and load plate204). Cold plate base plate 202 may comprise copper and/or anotherthermally conductive material, such that heat may be transferred fromdevice 116 to cold plate base plate 202, and from cold plate base plate202 to cooling fluid of liquid cooling system 118.

Heat-rejecting media assembly 200 may also include a cold plate housing206 mechanically coupled to load plate 204 and having fluid fittings 212and internal fluidic channels within cold plate housing 206 andfludically coupled to fluid fittings for receiving cooling fluid fromfluidic conduits 126, conveying cooling fluid proximate to cold plate202, and delivering cooling fluid from cold plate housing 206 to fluidicconduits 126. Heat-rejecting media assembly 200 may further includefasteners 210 for mechanically coupling load plate 204 to anothermechanical structure (e.g., a motherboard or other circuit board,another load plate, etc.), thus applying a force to load plate 204 tocause thermal mating of cold plate base plate 202 to a heat-generatingdevice (e.g., device 116).

As shown in FIGS. 2A, 2B, and 3, leak detection circuit 142 may bemechanically coupled to load plate 204 on a side of load plate 204opposite of cold plate base plate 202, and may be constructed with ageometry to account for other features of heat-rejecting media assembly200 (e.g., a hole in the middle of leak detection circuit 142 on accountof the presence of cold plate housing 206). As shown in FIG. 3, a layerof moisture wicking material 144 may be formed upon or otherwisemechanically coupled to the surface of leak detection circuit 142opposite of load plate 204, thus allowing moisture coming in contactwith moisture wicking material 144 to be wicked to various portions ofthe surface of leak detection circuit 142.

As so formed, leak detection system 138 comprising leak detectioncircuit 142 and moisture wicking material 144 may be located efficientlyin a location likely to capture moisture resulting from likely sourcesof leaks of cooling fluid from liquid cooling system 118 (e.g., atconnection points between fluidic conduits 126 and fluid fittings 212,perimeter of cold plate housing 206, o-rings or seals of cold platehousing 206, fluidic channels between cold plate housing 206 and coldplate base plate 202, etc.).

For purposes of clarity and exposition, the cooling system describedabove is an active cooling system, meaning the cooling system includes apump and operates in a closed loop. However, the systems and methodsherein are also suitable for use in passive systems and/or in aninformation technology loop, wherein pumping of cooling fluid iscentralized in a cooling distribution unit (CDU) and cooling fluid mayflow into and out of an information handling system through hoses,tubes, and other fluidic conduits coupled to a manifold in aninformation handling system rack or other enclosure.

As used herein, when two or more elements are referred to as “coupled”to one another, such term indicates that such two or more elements arein electronic communication or mechanical communication, as applicable,whether connected indirectly or directly, with or without interveningelements.

This disclosure encompasses all changes, substitutions, variations,alterations, and modifications to the example embodiments herein that aperson having ordinary skill in the art would comprehend. Similarly,where appropriate, the appended claims encompass all changes,substitutions, variations, alterations, and modifications to the exampleembodiments herein that a person having ordinary skill in the art wouldcomprehend. Moreover, reference in the appended claims to an apparatusor system or a component of an apparatus or system being adapted to,arranged to, capable of, configured to, enabled to, operable to, oroperative to perform a particular function encompasses that apparatus,system, or component, whether or not it or that particular function isactivated, turned on, or unlocked, as long as that apparatus, system, orcomponent is so adapted, arranged, capable, configured, enabled,operable, or operative. Accordingly, modifications, additions, oromissions may be made to the systems, apparatuses, and methods describedherein without departing from the scope of the disclosure. For example,the components of the systems and apparatuses may be integrated orseparated. Moreover, the operations of the systems and apparatusesdisclosed herein may be performed by more, fewer, or other componentsand the methods described may include more, fewer, or other steps.Additionally, steps may be performed in any suitable order. As used inthis document, “each” refers to each member of a set or each member of asubset of a set.

Although exemplary embodiments are illustrated in the figures anddescribed above, the principles of the present disclosure may beimplemented using any number of techniques, whether currently known ornot. The present disclosure should in no way be limited to the exemplaryimplementations and techniques illustrated in the figures and describedabove.

Unless otherwise specifically noted, articles depicted in the figuresare not necessarily drawn to scale.

All examples and conditional language recited herein are intended forpedagogical objects to aid the reader in understanding the disclosureand the concepts contributed by the inventor to furthering the art, andare construed as being without limitation to such specifically recitedexamples and conditions. Although embodiments of the present disclosurehave been described in detail, it should be understood that variouschanges, substitutions, and alterations could be made hereto withoutdeparting from the spirit and scope of the disclosure.

Although specific advantages have been enumerated above, variousembodiments may include some, none, or all of the enumerated advantages.Additionally, other technical advantages may become readily apparent toone of ordinary skill in the art after review of the foregoing figuresand description.

To aid the Patent Office and any readers of any patent issued on thisapplication in interpreting the claims appended hereto, applicants wishto note that they do not intend any of the appended claims or claimelements to invoke 35 U.S.C. § 112(f) unless the words “means for” or“step for” are explicitly used in the particular claim.

What is claimed is:
 1. An information handling system comprising: an information handling resource; a liquid cooling system for providing cooling of the information handling resource; and a leak detection system for detecting a leak of fluid from the liquid cooling system, the leak detection system comprising: a leak detection circuit having at least one moisture-sensitive portion configured to detect the presence of moisture proximate to the leak detection circuit and a portion configured to communicate one or more electrical signals indicative of the presence or absence of moisture proximate to the leak detection circuit; and a moisture wicking material mechanically coupled to the leak detection circuit and configured to transport moisture within the moisture wicking material to the at least one moisture-sensitive portion of the leak detection circuit, wherein the leak detection circuit comprises one of a flexible printed circuit board and a thin printed circuit board; wherein the liquid cooling system includes a thermally conductive cold plate mechanically coupled to a load plate and wherein the leak detection circuit is positioned overlying a surface of the load plate and the moisture wicking material comprises a layer of moisture wicking material overlying the leak detection circuit.
 2. The information handling system of claim 1, wherein the at least one moisture-sensitive portion of the leak detection circuit comprises at least one exposed electrically-conductive trace formed on the leak detection circuit.
 3. The information handling system of claim 1, wherein the leak detection system is mechanically coupled to at least one component of the liquid cooling system.
 4. The information handling system of claim 3, wherein the at least one component comprises heat-rejecting media of the liquid cooling system having one or more fluidic conduits for conveying cooling liquid of the liquid cooling system.
 5. The information handling system of claim 1, wherein the moisture wicking material comprises a material that enhances a change in impedance of the leak detection circuit in the presence of moisture within the moisture wicking material.
 6. The information handling system of claim 1, wherein the moisture wicking material comprises a material that changes in color in the presence of moisture within the moisture wicking material.
 7. A leak detection system for detecting a leak of fluid, the leak detection system comprising: a liquid cooling system for providing cooling of an information handling resource; a leak detection circuit having at least one moisture-sensitive portion configured to detect the presence of moisture proximate to the leak detection circuit and a second portion configured to communicate one or more electrical signals indicative of the presence or absence of moisture proximate to the leak detection circuit; and a moisture wicking material mechanically coupled to the leak detection circuit and configured to transport moisture within the moisture wicking material to the at least one moisture-sensitive portion of the leak detection circuit, wherein the leak detection circuit comprises one of a flexible printed circuit board and a thin printed circuit board wherein the liquid cooling system includes a thermally conductive cold plate mechanically coupled to a load plate and wherein the leak detection circuit is positioned overlying a surface of the load plate and the moisture wicking material comprises a layer of moisture wicking material overlying the leak detection circuit.
 8. The leak detection system of claim 7, wherein the at least one moisture-sensitive portion of the leak detection circuit comprises at least one exposed electrically-conductive trace formed on the leak detection circuit.
 9. The leak detection system of claim 7, wherein the leak detection system is configured to mechanically couple to at least one component of the liquid cooling system.
 10. The leak detection system of claim 9, wherein the at least one component comprises heat-rejecting media of the liquid cooling system having one or more fluidic conduits for conveying cooling liquid of the liquid cooling system.
 11. The leak detection system of claim 7, wherein the moisture wicking material comprises a material that enhances a change in impedance of the leak detection circuit in the presence of moisture within the moisture wicking material.
 12. The leak detection system of claim 7, wherein the moisture wicking material comprises a material that changes in color in the presence of moisture within the moisture wicking material.
 13. A method, comprising: detecting the presence of moisture proximate to a moisture-sensitive portion of a leak detection circuit of a liquid cooling system providing cooling of an information handling resource; communicating one or more electrical signals indicative of the presence or absence of moisture proximate to the moisture-sensitive portion of the leak detection circuit; and transporting moisture within a moisture wicking material mechanically coupled to the leak detection circuit to the moisture-sensitive portion of the leak detection circuit, wherein the leak detection circuit comprises one of a flexible printed circuit board and a thin printed circuit board; wherein the liquid cooling system includes a thermally conductive cold plate mechanically coupled to a load plate and wherein the leak detection circuit is positioned overlying a surface of the load plate and the moisture wicking material comprises a layer of moisture wicking material overlying the leak detection circuit.
 14. The method of claim 13, wherein the moisture-sensitive portion of the leak detection circuit comprises at least one exposed electrically-conductive trace formed on the leak detection circuit.
 15. The method of claim 13, wherein the leak detection system is configured to mechanically couple to at least one component of the liquid cooling system.
 16. The method of claim 15, wherein the at least one component comprises heat-rejecting media of the liquid cooling system having one or more fluidic conduits for conveying cooling liquid of the liquid cooling system.
 17. The method of claim 13, wherein the moisture wicking material comprises a material that enhances a change in impedance of the leak detection circuit in the presence of moisture within the moisture wicking material.
 18. The method of claim 13, wherein the moisture wicking material comprises a material that changes in color in the presence of moisture within the moisture wicking material. 